“MFKA SORBENTI VAUNING Cu(II) IONI BILAN HOSIL QILGAN BIRIKMASINING KOMPLEKSI TERMOGRAVIMETRIK TAHLILI”. Journal of Universal Science Research 2, no. 6 (June 5, 2024): 100–106. Accessed October 6, 2026. https://universalpublishings.com/index.php/jusr/article/view/6172.